Realme 3 smartphone is said to launch in coming weeks and from the last week, the company CEO Madhav Sheth has been promoting the device via various tipped information and Rap songs. Now he himself has shared some specifications of the device while he praises the past speculations and leaks.
Have seen many interesting speculations recently. Here’s one correct answer: realme 3 will have Helio P70 soc. I believe it is the best mid-ranger. pic.twitter.com/5j6lNEw44l
— Madhav Sheth (@MadhavSheth1) February 21, 2019
The Realme CEO tweeted on Thursday that the upcoming Realme 3 smartphone will come with a MediaTek chipset instead of Snapdragon processors. In past, we saw Realme jumping from MediaTek to Snapdragon and vice versa but this time around Realme seems to stick with the MediaTek chipsets. As this time Realme 3 will come with the MediaTek Helio P70 chipset as per the tweet shared by the CEO. The image shared by him compares the Snapdragon 660 with Helio P70 SoC and how it will be a perfect chipset for the Realme 3.
Other than this, the smartphone’s rear panel was showcased by the company on the official Realme twitter handle. The picture shows that the upcoming Realme 3 will sport a vertical camera setup and a diamond cut design. Realme seems to bring back the old diamond cut design which was very popular earlier as the Realme 1 had that sort of design. Another change the company does is the placement of cameras which is vertical instead of horizontal.
That’s what the tweet suggests, but some past leaks said that the Realme 3 smartphone will come with whopping 40-megapixel camera sensor just like the Xiaomi’s Redmi Note 7. It will also keep the 3.5mm headphone jack and possibly come with Type-C port for charging.
Now that this information is out and the CEO of the company himself is teasing it, we should get excited as the launch of the Realme 3 phone seems to be imminent.
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